CIRCUIT BOARD AND CIRCUIT BOARD ASSEMBLY

摘要

Disclosed is a circuit board which includes a first heat transfer structure which is made of a heat conductive material, and is at least partially inserted into an insulation part; a first via which has one side thereof in contact with the first heat transfer structure; a first metal pattern which is in contact with the other side of the first via; and a first combination member which is connected to the first metal pattern. The circuit board can realize at least one from improved heat dissipation performance, reduced weight and size thereof, improved reliability, reduced noises, and improved production efficiency.