| 发明名称 |
CIRCUIT BOARD, MULTILAYERED SUBSTRATE HAVING THE CIRCUIT BOARD AND METHOD OF MANUFACTURING THE CIRCUIT BOARD |
| 摘要 |
Disclosed is a circuit board which comprises a core part with a first via wherein the first via approximately has a double-headed drum or sandglass shape. The double-headed drum has a narrow waist in the middle. Therefore, the circuit board increases heat emitting efficiency while refining the via which penetrates the core. |
| 申请公布号 |
KR20150131932(A) |
申请公布日期 |
2015.11.25 |
| 申请号 |
KR20140193247 |
申请日期 |
2014.12.30 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
MIN, TAE HONG;KANG, MYUNG SAM;LEE, JUNG HAN;KO, YOUNG GWAN |
| 分类号 |
H05K3/46;H05K1/18 |
主分类号 |
H05K3/46 |
| 代理机构 |
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