| 摘要 |
The present invention relates to a nano-etching composition including a sulfuric acid, a hydrogen peroxide, an azole-based compound, cyclohexylamine, and the remainder consisting of water. The azole-based compound includes 5-aminotetrasol; and one or more kinds selected from benzotriazole, pyrazole, 3-aminotriazole, and sulfathiazole. When the nano-etching composition is used in soft etching during the production of a printed circuit board, loss of a copper film is minimized by reducing the amount that the copper surface is etched, and surface adhesion of a dried film to a copper substrate is improved. |
