发明名称 |
METHOD FOR CURING AN EPOXY RESIN COMPOSITION CONTAINING REACTIVE PHOSPHONATE |
摘要 |
<p>The invention pertains to a process for curing an epoxy resin composition, wherein a reactive phosphonate is used as curing agent together with 0 to 20% by weight of the total composition of a co-curing agent. Preferably, the phosphonate is an oligomeric phosphonate comprising a repeating unit OP(O)(R)-O-arylene and having a phosphorous content greater than 12% by weight, wherein R is a lower alkyl and arylene is a radical of a dihydric phenol, which phosphonate is used together with 5 to 15% by weight of the total composition of the co-curing agent. The cured epoxy resin composition can be used for making an electronic substrate material, such as a printed wiring board.</p> |
申请公布号 |
EP1719802(B2) |
申请公布日期 |
2015.11.25 |
申请号 |
EP20060118096 |
申请日期 |
2003.11.07 |
申请人 |
ICL-IP AMERICA INC. |
发明人 |
LEVCHIK, SERGEI;BUCZEK, MARK;PIOTROWSKI, ANDREW, M. |
分类号 |
C08G59/62;C08G59/40;C08K5/523;C08K5/5333;C08L61/34;C08L63/00;H05K1/03 |
主分类号 |
C08G59/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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