SOLDER POWDER MANUFACTURE METHOD AND SOLDER PASTE MANUFACTURE METHOD AND SOLDER PASTE USING LOW TEMPERATURE BONDING METHOD

摘要

The present invention relates to a solder powder manufacturing method, a solder paste manufacturing method, and a low temperature bonding method using a solder paste. The solder powder manufacturing method according to the present invention comprises: a step of preprocessing an object to be plated to remove a pollutant or an oxide from a surface of the object to be plated; a step of forming a nano multiple-layer plating layer on the object to be plated using an electroplating method; a step of separating the nano multiple-layer plating layer formed on the object to be plated; and a step of grinding the separated nano multiple-layer plating layer. According to the present invention, since a powder paste having a nano-layer can be manufactured in a size of a micrometer to alternately form nano-layers with all micrometer-sized powder to be used as nano-powder for low temperature bonding which is not easily oxidized unlike conventional nano-powder, has a low risk of fire or infiltration into a human body, is storable in air, does not exhibit a tangling growth phenomenon with adjacent particles at a room temperature, and is bondable at a low temperature and reduces a percentage of the nano-layer powder compared to a case of the nano-layer powder alone when the micrometer-sized powder having the nano-layers is mixed with ordinary powder having no nano-layer to further reduce a price.