发明名称 |
OPTICAL INTEGRATED DEVICE |
摘要 |
The invention is directed to the provision of an optical integrated device wherein provisions are made to be able to mount components on a substrate with high accuracy and high packing density without having to heat the components. The optical integrated device includes a substrate, an optical device optically coupled to a first device, and an electrical device mounted on top of the optical device or on top of a second device, wherein the optical device is bonded to the substrate by surface activated bonding via a first bonding portion formed from a metallic material on the substrate, and the electrical device is bonded to the optical device or the second device by surface activated bonding via a second bonding portion formed from a metallic material on the optical device or the second device. |
申请公布号 |
EP2779332(A4) |
申请公布日期 |
2015.11.25 |
申请号 |
EP20120847313 |
申请日期 |
2012.11.08 |
申请人 |
CITIZEN HOLDINGS CO., LTD. |
发明人 |
IDE, MASAFUMI;YODA, KAORU |
分类号 |
H01S5/022;G02B6/42;G02F1/377;H01L25/16;H01L33/50;H01S5/00;H01S5/40 |
主分类号 |
H01S5/022 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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