Through substrate features in semiconductor substrates

摘要

Through substrate features in semiconductor substrates are described. In one embodiment, the semiconductor device includes a through substrate via disposed in a first region of a semiconductor substrate. A through substrate conductor coil is disposed in a second region of the semiconductor substrate.

主权项

1. A semiconductor device comprising:
a through substrate via disposed in a first region of a semiconductor substrate; a through substrate conductor coil disposed in a second region of the semiconductor substrate; an insulating liner disposed on sidewall of the through substrate via; and a sidewall insulating liner disposed on the sidewall of the semiconductor device, the sidewall insulating liner covering a sidewall of the semiconductor substrate, wherein the insulating liner and the sidewall insulating liner comprise the same material.