Thermal leadless array package with die attach pad locking feature

摘要

Embodiments of the present invention are directed to a thermal leadless array package with die attach pad locking feature and methods of producing the same. A copper layer is half-etched on both surfaces to define an array of package contacts and a die attach pad. Each die attach pad is fully embedded in encapsulate material to provide a positive mechanical locking feature for better reliability. In some embodiments, the contacts include four active corner contacts.

主权项

1. A method of fabricating a semiconductor package comprising:
etching a leadframe to form a plurality of tie bars, a plurality of contacts and a die attach pad coupled to a portion of the plurality of contacts via the plurality of tie bars, and to form a plurality of areas around the die attach pad that are etched through the leadframe; selectively plating a top surface of the leadframe; laminating the bottom surface of the leadframe with tape; preparing the semiconductor package; etching a bottom surface of the leadframe to isolate the plurality of contacts from the die attach pad; and singulating the semiconductor package.