WIRING BOARD AND MANUFACTURING METHOD FOR THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a wiring board that is enhanced in positioning precision.SOLUTION: A wiring board is configured so that a wiring layer 62 and a positioning mark 63 are formed on the upper surface 61a of an insulation layer 61. The upper surface 62a of the wiring layer 62 is roughened. The upper surface of the positioning mark 63 is covered with a protection layer 64. The upper surface 61a of the insulation layer 61, the wiring layer 62 and the protection layer 64 are covered with an insulation layer 65. The insulation layer 65 is formed of an insulation material containing filler. A laser beam machine for forming a via hole 66 in the insulation layer 65 images the positioning mark 63 by an accessory camera 72, and forms the via hole 66 with a laser beam 71 on the basis of the recognized positioning mark 63.