Via structure for transmitting differential signals

摘要

A printed circuit board includes first and second signal pads located on a top surface of the printed circuit board and arranged to transmit a first differential signal, first and second signal vias extending through the printed circuit board and arranged to transmit the first differential signal, a first signal trace located on the top surface of the printed circuit board and connecting the first signal pad and the first signal via, and a second signal trace located on the top surface of the printed circuit board and connecting the second signal pad and the second signal via. The first and second signal vias are located on opposite sides of a line connecting the first and second signal pads.

主权项

1. A printed circuit board comprising:
first and second signal pads located on a top surface of the printed circuit board and arranged to transmit a first differential signal; first and second signal vias extending through the printed circuit board and arranged to transmit the first differential signal; a first signal trace located on the top surface of the printed circuit board and connecting the first signal pad and the first signal via; a second signal trace located on the top surface of the printed circuit board and connecting the second signal pad and the second signal via; first, second, third, and fourth ground pads located on the top surface of the printed circuit board and arranged to provide ground; first and second ground vias extending through the printed circuit board and arranged to provide ground; a first ground trace located on top surface of the printed circuit board and connecting the first and second ground pads; and a second ground trace located on the top surface of the printed circuit board and connecting the third and fourth ground pads; wherein the first and second signal vias are located on opposite sides of a line connecting the first and second signal pads; and the first differential signal includes first and second signal that are complementary to each other; the first signal pad, the first signal via, and the first signal trace transmit the signal; the second signal pad, the second signal via, and the second signal trace transmit the second signal.