| 发明名称 | Forming magnetic microelectromechanical inductive components | ||
| 摘要 | A micro-electromechanical device and method of manufacture are disclosed. A sacrificial layer is formed on a silicon substrate. A metal layer is formed on a top surface of the sacrificial layer. Soft magnetic material is electrolessly deposited on the metal layer to manufacture the micro-electromechanical device. The sacrificial layer is removed to produce a metal beam separated from the silicon substrate by a space. | ||
| 申请公布号 | US9193584(B2) | 申请公布日期 | 2015.11.24 |
| 申请号 | US201514608817 | 申请日期 | 2015.01.29 |
| 申请人 | International Business Machines Corporation | 发明人 | Gallagher William J.;O'Sullivan Eugene J.;Wang Naigang |
| 分类号 | H01L21/00;B81C1/00;H01L43/14;B81B3/00;H01L43/10;H01L43/12;H01L49/02;H01F41/04 | 主分类号 | H01L21/00 |
| 代理机构 | Cantor Colburn LLP | 代理人 | Cantor Colburn LLP ;Alexanian Vazken |
| 主权项 | 1. A method of manufacturing a micro-electromechanical device, comprising: forming a metal layer of the micro-electromechanical device on a sacrificial layer of a wafer, wherein the sacrificial layer includes a portion of a substrate of the wafer; removing the sacrificial layer to produce a suspended metal beam coupled to at least one support structure of the wafer; and electrolessly depositing a soft magnetic material on the metal layer to manufacture the micro-electromechanical device. | ||
| 地址 | Armonk NY US | ||