Stacked device identification assignment

摘要

Some embodiments include apparatus and methods having dice arranged in a stack. The dice include at least a first die and a second die, and a connection coupled to the dice. The connection may be configured to transfer control information to the first die during an assignment of a first identification to the first die and to transfer the control information from the first die to the second die during an assignment of a second identification to the second die.

主权项

1. An apparatus comprising:
a first die including a first via going through the first die, and a second via going through the first die; a second die arranged in a stack with the first die, the second die including a third via going through the second die, and a fourth via going through the second die, wherein the first via and the fourth via are substantially aligned in a direction perpendicular to the stack, and the second via and the third via are substantially aligned in a direction perpendicular to the stack; and conductive joints outside the first die and the second die and between the first die and the second die, wherein one of the conductive joints is coupled to the second via and the third via, and none of the conductive joints is coupled to the first via and the fourth via.