发明名称 RESIN LAYER REMOVAL METHOD
摘要 PROBLEM TO BE SOLVED: To provide a resin layer removal method that, when a resin layer is removed from a composite made by forming the resin layer on a glass substrate, can remove the resin layer from the glass substrate without heat treatment at a high temperature, and thus can simplify treatment without significant alteration of equipment to enable improvement of productivity at the recycle of the glass substrate, reduction of treatment cost and the like.SOLUTION: A resin layer removal method for removing a resin layer disposed on a glass substrate includes a step of bringing an alkaline aqueous solution, having an alkali concentration of 15 mass% or more and containing 3 mass% or more of a compound represented by formula (1), into contact with the resin layer to remove the resin layer. RO-(LO)-H (1) (In the formula (1), R represents an alkyl group; L represents an alkylene group; and n represents an integer of 1 or more.)
申请公布号 JP2015209371(A) 申请公布日期 2015.11.24
申请号 JP20140093947 申请日期 2014.04.30
申请人 ASAHI GLASS CO LTD 发明人 TERUI HIROTOSHI;ISHIKAWA TOMOAKI;YOKOYAMA TETSUSHI;YAMAUCHI MASARU
分类号 C03C23/00;B08B3/08;B09B3/00;C11D7/06;C11D7/26;C11D17/08;G02F1/1333 主分类号 C03C23/00
代理机构 代理人
主权项
地址