FRONT FACE PROTECTION ADHESIVE TAPE FOR REAR FACE GRINDING FOR SEMICONDUCTOR WAFER, AND GRINDING METHOD OF SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To provide a front face protection adhesive tape for rear face grinding for semiconductor wafer which improves workability by providing both visibility in sticking and heat resistance without generating a sensor recognition problem even if applied to a semiconductor wafer that thin film grinding is required in a rear face grinding step for a silicon wafer or the like, and a grinding method of the semiconductor wafer.SOLUTION: The front face protection adhesive tape for rear face grinding for the semiconductor wafer is formed by providing a base material 1 and an adhesive layer 2 on one side of the base material. Surface roughness on the side of the base material where the adhesive layer is not formed is Rz=0.7 to 5.0 μm. Full light transmittance in a wavelength 500 to 600 nm of the front face protection adhesive tape for rear face grinding for the semiconductor wafer is 40 to 80%. A difference between a color difference (&Dgr;EM) of a mirror wafer and a color difference (&Dgr;ET) in the state where the front face protection adhesive tape for rear face grinding for the semiconductor wafer is stuck to the mirror wafer is &Dgr;ET-&Dgr;EM>6.5.