发明名称 半導体装置の製造方法
摘要 <p>According to one embodiment, a producing method for a semiconductor device includes first impurities containing phosphorus or boron in the form of molecular ion and second impurities containing carbon, fluorine or nitrogen with less implantation amount than this phosphorus or boron in the form of molecular ion are implanted into a semiconductor layer to form an impurity implantation layer.</p>
申请公布号 JP5820243(B2) 申请公布日期 2015.11.24
申请号 JP20110244609 申请日期 2011.11.08
申请人 发明人
分类号 H01L21/265;H01L21/336;H01L21/76;H01L21/8238;H01L21/8247;H01L27/092;H01L27/115;H01L29/78;H01L29/788;H01L29/792 主分类号 H01L21/265
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