发明名称 |
Insulated wire having a layer containing bubbles, electrical equipment, and method of producing insulated wire having a layer containing bubbles |
摘要 |
An insulated wire, containing: an insulating film made from a thermosetting resin disposed on a conductor directly or via an insulating layer interposed therebetween, in which the insulating film made from a thermosetting resin is a layer containing bubbles prepared by baking a varnish of thermosetting resin, and a layer containing no bubbles is formed as an upper or lower layer of the layer containing bubbles. |
申请公布号 |
US9196401(B2) |
申请公布日期 |
2015.11.24 |
申请号 |
US201414459722 |
申请日期 |
2014.08.14 |
申请人 |
FURUKAWA ELECTRIC CO., LTD.;FURUKAWA MAGNET WIRE CO., LTD. |
发明人 |
Oya Makoto;Muto Daisuke;Onodera Makoto;Tomizawa Keiichi |
分类号 |
H01B7/00;H01B17/42;C09D179/08;C09D201/00;H01B13/06;H01B7/29;C08G73/10;C08G73/14;B05D3/02;H01F27/28;H01F5/06;H01B3/30 |
主分类号 |
H01B7/00 |
代理机构 |
Birch, Stewart, Kolasch & Birch, LLP |
代理人 |
Birch, Stewart, Kolasch & Birch, LLP |
主权项 |
1. An insulated wire, comprising:
an insulating film made from a thermosetting resin disposed on a conductor directly or via an insulating layer interposed therebetween, wherein the insulating film made from a thermosetting resin is a layer containing bubbles prepared by baking a varnish of thermosetting resin, and wherein a layer containing no bubbles is formed as an upper or lower layer of the layer containing bubbles, and wherein the insulating layer containing bubbles made from a thermosetting resin has bubbles of an average size of 10 μm or less, an insulating layer containing no bubbles with a thickness of 1 μm or greater is disposed as an upper layer and/or a lower layer of the insulating layer containing bubbles, and the insulating layer containing bubbles made from a thermosetting resin is laminated in one or more layers. |
地址 |
Tokyo JP |