| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for an insulator layer of a printed wiring board, which has good dispersion stability, shows an adequate melt viscosity, and enables the suppression of warp in the step of mounting a part.SOLUTION: A resin composition for an insulator layer of a printed wiring board comprises: a nonvolatile component; and an inorganic filler of which the content is 40-75 vol.% to 100 vol.% of the nonvolatile component in the resin composition, and the geometric parameter A satisfies the following condition: 20≤6A≤40, where A=SR&rgr;/6. [In the formula, S represents a specific surface area (m/g) of the inorganic filler; R represents an average particle diameter (μm) of the inorganic filler; and &rgr; represents a density (g/cm) of the inorganic filler.] |
