| 摘要 |
<p>The invention provides a bonding apparatuse for reducing defect and warping of laminating plate after bonding and a bonding method. The bonding device (10) is used for bonding a plate shaped component (2) and a flexible plate (3), wherein, the device comprises: an upper working table (20) for absorbing a plate shaped component; a lower working table quippped below the upper working table (20) for carrying the flexbile plate (3); a rotating roller (50) which contacts the lower surface of the flexible plate (3) supported by the lower working table (40) and flexibly deforms the flexible plate (3) by dead weight; a pressing part (50) for pressing the flexible plate (3) to the plate shaped component (2) absorbed by the upper working table (20) by the rotating roller (50); a moving mechanism (70) for moving the rotating roller (50) and the pressing part (60) relative to the upper working table (20).</p> |
