| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a technique of forming a wiring groove in an insulating film while keeping the shapes of the bottom face and the side face excellently. <P>SOLUTION: A temporary pattern is formed on a substrate. An interlayer insulating film is formed on the substrate to surround the temporary pattern. Following to formation of the interlayer insulating film, the temporary pattern is removed. A first barrier film and a seed film are formed on the side face and the bottom face of a recess which appeared by removing the temporary pattern. The recess is filled with a wiring material by depositing the wiring material on the seed film. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
