| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board in which the stray capacitance formed between a through electrode is small. <P>SOLUTION: The wiring board includes a substrate 2 having a via hole 2c penetrating the first surface 2a and the second surface 2b facing the first surface 2a, a first insulating film 3 provided on the first surface 2a of the substrate 2 and including a thermal oxide film, a third insulating film 5 provided on the inner surface of the via hole 2c and including a thermal oxide film, and a conductor 7 surrounded by the third insulating film 5 in the via hole 2c. The third insulating film 5 on the inner surface of the via hole 2c is thicker than the first insulating film 3 on the first surface 2a. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
