发明名称 Dental root canal filling material having improved thermal conductive characteristics
摘要 A root canal filling material incorporates heat conductive particles of sub-micron size dispersed in a heat flowable matrix of endodontic filling material. The particle size is 1 micron or less (e.g., 0.5 to 1 micron, or nanoparticles of 100 nm or less). The addition of high heat conductive particles in the heat flowable matrix material improves the overall heat conductivity of the root canal filling material. During root canal treatment procedure, the filling material softens more thoroughly to fill the root canal apex and to form a seal of higher integrity at the root canal apex area, at a significantly lower operating temperature. The inventive filling material may be provided in bulk (e.g., pellet form) for use with an injection tool that heats and injects softened filling material into root canal cavities, or pre-shaped in the form of dental root canal filling cones (or points).
申请公布号 US9192545(B2) 申请公布日期 2015.11.24
申请号 US201313899561 申请日期 2013.05.21
申请人 发明人 Li Nathan Y.
分类号 A61K6/00;A61K6/04;A61K6/027;A61K6/02 主分类号 A61K6/00
代理机构 Liu & Liu 代理人 Liu & Liu
主权项 1. A root canal filling material, comprising: a matrix comprising a heat flowable material, wherein the heat flowable material is Gutta Percha; and heat conductive particles of a size 1 micron or less dispersed in the heat flowable material of the matrix, wherein the particles are non-metallic.
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