发明名称 研磨パッド及び研磨パッドの製造方法
摘要 Provided are a method for manufacturing a finishing polishing pad, and the polishing pad, allowing few polishing flaws and being capable of forming a stable film, by means of a polishing pad having a polyurethane resin film as a polishing layer on a film-formation substrate, the polishing pad characterized in that the polishing layer comprises a polishing slurry holding section and a polishing slurry flow channel section, the polishing slurry holding section having air bubbles and the polishing slurry flow channel section not having air bubbles, and the polishing layer also contains hydrophobic spherical silica in the amount of 0.5 to 6% of the total polyurethane resin film mass.
申请公布号 JP5821133(B2) 申请公布日期 2015.11.24
申请号 JP20120077416 申请日期 2012.03.29
申请人 富士紡ホールディングス株式会社 发明人 立野 哲平;宮坂 博仁;松岡 立馬;金澤 香枝;宮澤 文雄
分类号 B24B37/24;B24B37/26;H01L21/304 主分类号 B24B37/24
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