| 摘要 |
PROBLEM TO BE SOLVED: To achieve memory access to a semiconductor device after packaging without increasing the number of terminals of a module.SOLUTION: A sensor module 100 which includes a packaged semiconductor device 10 inside and has a module power supply terminal T101 and output terminals T102 and T103 but does not have a data communication dedicated terminal. The semiconductor device 10 detects whether the module output terminal T102 is in a non-conduction state from a MON terminal T15, and when the module output terminal T102 is in a non-conduction state, transits from a normal mode to a communication mode and divert the module output terminal T103 or the module power supply terminal T101 to perform communication with the outside of the sensor module 100. |
