发明名称 |
WAFER MAPPING DEVICE AND LOAD PORT WITH THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To enable even load ports processing wafers in different sizes to share a wafer mapping device.SOLUTION: A mapping sensor 5 of which an optical axis L1 is turned in a horizontal direction from side to side is fitted to a mapping device 4 while forming a span from side to side between a light-emitting part 5a and a light-receiving part 5b of the mapping sensor 5 narrower than a span of a front opening of an open cassette 12 with a small dimension among containers with different dimensions to be conveyed to the load port. A first jump-out sensor 6 of which an optical axis L2 is turned in a horizontal direction from side to side is fitted to the mapping device 4 while being separated forward in a moving direction of the mapping sensor 5, and a second jump-out sensor 7 is provided of which the optical axis is turned in the moving direction of the mapping sensor 5 from up to down. Thus, even the load ports processing wafers W1 and W2 in different sizes can share a wafer mapping device 1. |
申请公布号 |
JP2015211164(A) |
申请公布日期 |
2015.11.24 |
申请号 |
JP20140092924 |
申请日期 |
2014.04.28 |
申请人 |
SINFONIA TECHNOLOGY CO LTD |
发明人 |
NATSUME MITSUO;OSAWA SHINKO;MORIHANA TOSHIMITSU;OCHIAI MITSUTOSHI |
分类号 |
H01L21/677 |
主分类号 |
H01L21/677 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|