| 摘要 |
PROBLEM TO BE SOLVED: To inhibit non-uniform curing of mold resin and prevent curving of a package, even where the thickness of the mold resin increases in a mold package of half mold type.SOLUTION: Electronic components 20, 21 mounted on one face 11 of a base plate 10 comprise: a first component 20; and a second component 21 higher than the first component 20. Within mold resin 30, a metal frame member 40 with a top plate part 41 and a coupling part 42 is provided. The top plate part 41 is located in a part that is present in almost the entire area of the mold resin 30 and that has a size equal to or smaller than a half of the mold resin 30 from the one face 11 of the base plate 10 of the mold resin 30. The top plate part 41 covers the first component 20 and has a through-hole 41c for the second component. The second component 21 projects beyond the one face 11 of the base plate 10 higher than the top plate part 41 via the through-hole 41c. |
