High power dielectric carrier with accurate die attach layer

摘要

A system for bonding a die to a high power dielectric carrier such as a ceramic dielectric core with double-sided conductive layers is described. In the system, the upper conductive layer has a first area whose surface has a first wettability. A second area that at least partially surrounds the first area has a surface with a second wettability that is greater than the first wettability. During bonding, an adhesive material bonding a chip to the substrate spreads among the first area by a downward force placed on the chip. Due to the difference in wettability, the adhesive material then spreads among the second area by a wetting force generated by the greater second wettability of the second area surface causing the chip to be drawn down until reaching a predetermined position. The predetermined position can be determined by substrate protrusions or substrate cavities.

主权项

1. A high power dielectric carrier including a dielectric substrate and at least an upper conductive layer, the upper conductive layer being divided into plural conductive portions separated and electrically isolated from each other, the upper conductive layer comprising:
a first area whose surface has a first wettability; a second area, which at least partially surrounds the first area, whose surface has a second wettability greater than the first wettability, such that when a die is bonded to the upper conductive layer with an adhesive material, the adhesive material spreads among the first area caused by a downward force placed on the die and then spreads among the second area by a wetting force generated by the greater second wettability of the second area surface, causing the die to be drawn down; one or more protrusions formed on the upper conductive layer, and arranged to act as stops for placement of the die when the die is drawn down due to the wetting force, such that the die is bonded to the upper conductive layer of the high power dielectric carrier by the adhesive material without adhesive backflow and to form a uniform bondline between the die and the carrier by the wetting force and the one or more protrusions; a cavity containing the first area or/and the second area, wherein the cavity has the one or more protrusions formed therein, and is formed in one of the plural conductive portions; an insulating mask covering the surfaces of the conductive portions and exposing one or more I/O points for interconnection; and one or more electrical bridges constructed across the conductive portions via the I/O points to form a target electrical component;wherein the bonded die electrically contacts the one or more protrusions, such that an internal electrical path is formed between the die and the I/O points through the conductive portion without the need for additional wiring.