| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing composition having a high polishing speed which is capable of stably polishing a substrate having an organic film in a short time, and a polishing method using the same.SOLUTION: The polishing composition contains abrasive grains and an organic compound having a functional group containing a sulfur atom and has a pH of 2-11. The organic compound containing a sulfur atom is preferably an anionic surfactant and an organic acid. The organic compound containing a sulfur atom is physically adsorbed on and/or chemically bonded to an organic film surface to be polished, thereby hydrophilizing the organic film surface. This effect increases the affinity between the abrasive grains and the organic film surface, so that a high polishing speed is exhibited. |
