发明名称 |
POLISHING DEVICE, JIG FOR MEASURING ABRASIVE PAD PROFILE, AND METHOD FOR MEASURING ABRASIVE PAD PROFILE |
摘要 |
PROBLEM TO BE SOLVED: To measure a profile of a surface shape of an abrasive pad in a short time and with a good accuracy.SOLUTION: A first polishing device includes: a polishing table 30A to which an abrasive pad 10 for polishing a polishing object is bonded; a drive part for driving rotation of the polishing table 30A; a top ring 31A which holds the polishing object and presses the object onto the abrasive pad 10; and a line laser sensor 300 which is so disposed as to face the abrasive pad 10, irradiates a surface of the abrasive pad 10 with laser beam in a line form and measures a profile of a surface shape of the abrasive pad 10 on the basis of reflection laser beam reflected from the abrasive pad 10. |
申请公布号 |
JP2015208840(A) |
申请公布日期 |
2015.11.24 |
申请号 |
JP20140093965 |
申请日期 |
2014.04.30 |
申请人 |
EBARA CORP |
发明人 |
ISONO YOSHINOBU;TAKAHASHI NOBUYUKI |
分类号 |
B24B37/34;B24B49/12;G01B11/24;G01B11/30;H01L21/304 |
主分类号 |
B24B37/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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