发明名称 POLISHING DEVICE, JIG FOR MEASURING ABRASIVE PAD PROFILE, AND METHOD FOR MEASURING ABRASIVE PAD PROFILE
摘要 PROBLEM TO BE SOLVED: To measure a profile of a surface shape of an abrasive pad in a short time and with a good accuracy.SOLUTION: A first polishing device includes: a polishing table 30A to which an abrasive pad 10 for polishing a polishing object is bonded; a drive part for driving rotation of the polishing table 30A; a top ring 31A which holds the polishing object and presses the object onto the abrasive pad 10; and a line laser sensor 300 which is so disposed as to face the abrasive pad 10, irradiates a surface of the abrasive pad 10 with laser beam in a line form and measures a profile of a surface shape of the abrasive pad 10 on the basis of reflection laser beam reflected from the abrasive pad 10.
申请公布号 JP2015208840(A) 申请公布日期 2015.11.24
申请号 JP20140093965 申请日期 2014.04.30
申请人 EBARA CORP 发明人 ISONO YOSHINOBU;TAKAHASHI NOBUYUKI
分类号 B24B37/34;B24B49/12;G01B11/24;G01B11/30;H01L21/304 主分类号 B24B37/34
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