| 摘要 |
PROBLEM TO BE SOLVED: To provide techniques relating to cooling of semiconductor devices.SOLUTION: A semiconductor device includes a semiconductor chip having a first silicon substrate with opposing first and second surfaces, a semiconductor device formed at or in the first surface, a plurality of first contact pads formed at the first surface which are electrically coupled to the semiconductor device, a layer of thermally conductive material on the second surface, and a plurality of first vias formed partially through the layer of thermally conductive material. |
