| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin package for semiconductor light-emitting device in which adhesion of a resin molding and a lead is excellent and no gap exists therebetween, reflectance from visible light to the near-ultraviolet light is high after curing, and a silicon resin composition suitable for liquid injection molding is used. <P>SOLUTION: In a resin package for semiconductor light-emitting device having a recess on which a semiconductor light-emitting device is mounted, the recess of the resin package consists of the bottom face and a side face. A resin molding formed of a thermosetting silicon resin composition containing (A) polyorganosiloxane forming the side face of the recess, (B) a white pigment having aspect ratio of primary particles of 1.2-4.0 and primary particle diameter of 0.1-2.0 μm, and (C) a thermosetting silicon resin composition containing a hardening catalyst, and at least a pair of positive and negative leads disposed correspondingly so as to form a part of the bottom face of the recess are formed by integrating both bonding surfaces with no gap by using a liquid injection molding method. <P>COPYRIGHT: (C)2013,JPO&INPIT |
