| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid injection head in which connecting regions are applied with equal loads, and can be made surely conductive at thermal compression bonding for connecting electrode terminals and lower wiring terminals.SOLUTION: A liquid injection head 1 comprises a head chip 2 having electrode terminals 4, and a circuit board 3 connected to the head chip 2. The circuit board 3 comprises: a plurality of lower wiring terminals 5 which correspond to a plurality of the electrode terminals 4, respectively, and are located at a lower face LP; penetration electrodes 6 which penetrate an upper face TP from the lower face LP, and are electrically connected to the lower wiring terminals 5; upper wiring 7 which corresponds to each of a plurality of the lower wiring terminals 5, and is located at the upper face TP; and upper common wiring 8 which corresponds to each of the penetration electrodes 6, and is located at the upper face TP. A plurality of the electrode terminals 4 and a plurality of the lower wiring terminals 5 are made conductive to each other in connecting regions R, the upper wiring 7 covers a plurality of the connecting regions R in a plane view from a vertical direction of the upper face TP, and a space S in which the upper wiring 7 is not located is formed between the adjacent connecting regions R. |
