| 摘要 |
<p>[Problem] To provide a discharge gap-filling composition having good coating properties (potting properties), and to provide an electrostatic discharge protector which can conveniently take ESD countermeasures in electronic circuit boards of various designs while having freedom of shape, has excellent operating properties during discharge and is capable of being downsized and reduced in cost, by the use of the composition. [Solution] The discharge gap-filling composition of the present invention is characterized in that the composition comprises a metal powder (A), a binder component (B) and a diluent (C), the diluent (C) has two or more characteristic groups in a molecule, and the characteristic groups are not directly bonded to each other in a molecule but are bonded to each other through a hydrocarbon group or a silicon atom.</p> |
