发明名称 Method for molding molded foam, and molded foam
摘要 The invention provides a molded foam molding method capable of obtaining a molded foam in which pinholes may not be formed with ease even when a blow ratio is high and which has a high expansion ratio. The invention also provides a molded foam which includes no pinholes, is reduced in weight, and is excellent in heat insulating property. The molding method includes blending a polypropylene-based resin having an equilibrium compliance from 2.0 to 6.0 (10−3×Pa−1) with a foaming agent and kneading the blend in an extruder. The extruded foamed resin is molded so as to be fit along a mold by a pressurized fluid. Moreover, the molded foam is formed by the method described above, and has an expansion ratio from 1.5 to 5.0 times and an impact strength of not less than 30 kg·cm.
申请公布号 US9193100(B2) 申请公布日期 2015.11.24
申请号 US201012913014 申请日期 2010.10.27
申请人 KYORAKU CO., LTD. 发明人 Onodera Masaaki;Sumi Takehiko;Tamada Teruo;Igarashi Yu;Ohno Yoshinori
分类号 B29C44/50;B29C49/00;C08J9/06;B29K23/00;B29K105/04;B29L23/00;B29L31/30 主分类号 B29C44/50
代理机构 Hauptman Ham, LLP 代理人 Hauptman Ham, LLP
主权项 1. A method for molding a molded foam, comprising the steps of: blending a polypropylene-based resin having an equilibrium compliance from 2.0 to 6.0 (10−3 x Pa−1), which is a blend mixed with 70 wt % or more of a regrind of the molded foam, with a foaming agent and kneading the blend in an extruder; and molding the foamed resin extruded through the extruder so as to be fit along a mold by a pressurized fluid, wherein molding the foamed resin comprises blowing air into the extruded resin to obtain a largest blow ratio of 0.2 or more and 0.5 or less.
地址 Kyoto JP
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