| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor sealing resin composition formable of a coating film which ensures little variation of its relative dielectric constant and little variation of its dielectric loss tangent under high temperature and high humidity conditions, by improving the compressive strength and moisture resistance of silica-based particles having a cavity inside, and to provide a substrate capable of retaining high moisture resistance for a long time. <P>SOLUTION: Silica-based particles have a cavity on the inside of a nonporous shell silica layer, and have a void fraction in the range of 20-95 vol.% and an average particle diameter in the range of 0.1-50μm. The cavities of the silica-based particles have negative pressure of≤133 hPa. The silica-based particles have compressive strength in the range of 0.1-200 kgf/mm<SP POS="POST">2</SP>. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
