| 发明名称 | Optical device package having a groove in the metal layer | ||
| 摘要 | Provided are an optical device package and a method of manufacturing the same. The method of manufacturing the optical device package according to an exemplary embodiment of the present invention comprises: forming a metal layer on an insulating layer on which via holes are formed; forming a circuit pattern layer by etching the metal layer; forming a boundary part in a predetermined part of the metal layer; mounting an optical device on the circuit pattern layer; and forming a molding part by applying a transparent material to the optical device, wherein the predetermined part is a part corresponding to a boundary of the molding part. | ||
| 申请公布号 | US9196811(B2) | 申请公布日期 | 2015.11.24 |
| 申请号 | US201214236016 | 申请日期 | 2012.07.27 |
| 申请人 | LG INNOTEK CO., LTD. | 发明人 | Paik Jee Heum;Cho Sang Ki |
| 分类号 | H01L21/00;H01L33/00;H01L33/62;H01L33/54;H01L33/48 | 主分类号 | H01L21/00 |
| 代理机构 | Saliwanchik, Lloyd & Eisenschenk | 代理人 | Saliwanchik, Lloyd & Eisenschenk |
| 主权项 | 1. A method of manufacturing an optical device package comprising: forming a metal layer on an insulating layer on which via holes are included; forming a circuit pattern layer by etching the metal layer; forming a boundary part in a predetermined part of the metal layer; mounting an optical device on the circuit pattern layer; and forming a molding part by applying a transparent material to the optical device, wherein the predetermined part is a part corresponding to a boundary of the molding part, and wherein the boundary part includes a groove shape. | ||
| 地址 | Seoul KR | ||