发明名称 Laser bonding method
摘要 Provided is a laser bonding method which is a highly reliable laser bonding method for a thermoplastic resin and a metal, wherein the adhesiveness at an interface between a thermoplastic resin and a metal is improved to prevent peeling due to heat stress at the time of bonding. Accordingly, the method includes a step of forming an oxide layer having a higher oxygen functional group content than a bulk thermoplastic resin by subjecting at least a thermoplastic resin on the side of a bonding interface to a surface modification treatment prior to bonding, and the thermoplastic resin and a metal are bonded to each other by applying pressure and irradiating a laser in a state where the surface energy of the metal on the bonding surface side is increased to be larger than that of the thermoplastic resin having the oxide layer formed thereon.
申请公布号 US9193138(B2) 申请公布日期 2015.11.24
申请号 US201113816097 申请日期 2011.06.29
申请人 Hitachi, Ltd. 发明人 Arai Satoshi;Hyugano Takeshi
分类号 B32B37/06;B29C65/44;B29C65/00;B29C65/16;B29C65/82 主分类号 B32B37/06
代理机构 Crowell & Moring LLP 代理人 Crowell & Moring LLP
主权项 1. A laser bonding method, comprising: a step of subjecting an interface of a thermoplastic resin to a surface modification treatment to form or increase an oxygen functional group; and a step of bonding the interface of the thermoplastic resin subjected to the surface modification treatment to a metal by heating through laser irradiations; wherein the bonding step is performed in a state where the surface energy of the metal on a bonding surface side is increased to be larger than that of the interface subjected to the surface modification treatment.
地址 Tokyo JP