发明名称 |
Laser bonding method |
摘要 |
Provided is a laser bonding method which is a highly reliable laser bonding method for a thermoplastic resin and a metal, wherein the adhesiveness at an interface between a thermoplastic resin and a metal is improved to prevent peeling due to heat stress at the time of bonding. Accordingly, the method includes a step of forming an oxide layer having a higher oxygen functional group content than a bulk thermoplastic resin by subjecting at least a thermoplastic resin on the side of a bonding interface to a surface modification treatment prior to bonding, and the thermoplastic resin and a metal are bonded to each other by applying pressure and irradiating a laser in a state where the surface energy of the metal on the bonding surface side is increased to be larger than that of the thermoplastic resin having the oxide layer formed thereon. |
申请公布号 |
US9193138(B2) |
申请公布日期 |
2015.11.24 |
申请号 |
US201113816097 |
申请日期 |
2011.06.29 |
申请人 |
Hitachi, Ltd. |
发明人 |
Arai Satoshi;Hyugano Takeshi |
分类号 |
B32B37/06;B29C65/44;B29C65/00;B29C65/16;B29C65/82 |
主分类号 |
B32B37/06 |
代理机构 |
Crowell & Moring LLP |
代理人 |
Crowell & Moring LLP |
主权项 |
1. A laser bonding method, comprising:
a step of subjecting an interface of a thermoplastic resin to a surface modification treatment to form or increase an oxygen functional group; and a step of bonding the interface of the thermoplastic resin subjected to the surface modification treatment to a metal by heating through laser irradiations; wherein the bonding step is performed in a state where the surface energy of the metal on a bonding surface side is increased to be larger than that of the interface subjected to the surface modification treatment. |
地址 |
Tokyo JP |