发明名称 研磨パッド及び研磨パッドの製造方法
摘要 The purpose of the invention is to provide: a polishing pad that has minute bubbles that are substantially uniform in the thickness direction and is already provided with openings without performing an opening-forming process such as surface grinding; and a manufacturing method for same. A polishing pad manufacturing method comprising: a process (1) of applying a mixed solution containing a polyurethane resin and an organic solvent onto a film-forming base material; after the application process, a process (2) of exposing the polyurethane resin for two minutes or more to an atmosphere of 10-80°C temperature and 65-100% relative humidity; and a process (3) of coagulating the polyurethane resin by immersion in a coagulation solution.
申请公布号 JP5822159(B2) 申请公布日期 2015.11.24
申请号 JP20110286574 申请日期 2011.12.27
申请人 发明人
分类号 B24B37/24;B05D3/10;B05D7/24;C08J5/14;C08J9/28;H01L21/304 主分类号 B24B37/24
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