| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming a Pd layer by electroless plating in order to form a semiconductor device, and an electroless plating solution without including an environmental load material (B, P, hydrazine, formalin).SOLUTION: The solution includes Pdions, and Coor Tiions as a reducer. Amine (aqueous ammonia, etc.) may be used as a complexing agent. The electroless plating solution is preferably mixed just before electroless plating. |
