发明名称 モジュールおよび電子機器
摘要 A module includes a first rigid substrate including an analog circuit; a second rigid substrate including a digital circuit; a third rigid substrate including an angular velocity sensor; a first connecting portion that connects the first rigid substrate and the second rigid substrate so as to electrically connect the analog circuit and the digital circuit, and that has flexibility; and a second connecting portion that connects the first rigid substrate and the third rigid substrate so as to electrically connect the analog circuit and the angular velocity sensor, and that has flexibility.
申请公布号 JP5821290(B2) 申请公布日期 2015.11.24
申请号 JP20110122792 申请日期 2011.05.31
申请人 セイコーエプソン株式会社 发明人 佐久間 正泰;小林 祥宏;北村 昇二郎;茅野 岳人;小神 通治
分类号 G01C19/5783;G01P1/02;G01P15/08;H05K1/14 主分类号 G01C19/5783
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