| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve a problem that electronic components cannot be disposed near a housing of a substrate because the electronic components provided on the substrate may contact with the housing due to vibrations or the like and cause a short circuit in an imaging apparatus. <P>SOLUTION: An imaging apparatus A includes: a holding member 21 holding a photographic optical system 1; a first substrate 41 which is joined to the holding member 21 and is provided with an image pickup device 411 optically converting an image formed by the photographic optical system and a first connector 412 for connection; a second substrate 42 provided with a second connector 422 connecting with the first connector 412 and electronic components 42e; and a shield case 5 which is fixed to the holding member 21 enclosing around the first substrate 41 and the second substrate 42. The second substrate 42 has a joining part 42a joined to the shield case 5, and at least an electronic component 42f which is located near the joining part 42a of the shield case 5, from among the electronic components 42e provided on the second substrate 42, is covered by a non conductive material. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
