| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer wiring board capable of obtaining a multilayer wiring board excellent in dimensional stability and shape accuracy, and a multilayer wiring board manufactured by such a method. <P>SOLUTION: A manufacturing method of a multilayer wiring board comprises: a step of forming a conductor pattern 37 on a surface 21a of a thermoplastic resin sheet 21; a step of positioning a laminate 121 formed by laminating a plurality of resin sheets 21 between a press plate 61 and a press plate 62 and arranging cushion sheets 51, 52 having compressibility at least between the laminate 121 and the press plate 61 or between the laminate 121 and the press plate 62; and a step of pressurizing the laminate 121 in a lamination direction while heating it. During the step of pressurizing the laminate 121 while heating it, the cushion sheets 51, 52 deform so that the shape of the conductor pattern 37 is transferred. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
