| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a heat conductive silicone gel composition which can be filled in a module comprising an electric/electronic parts and a circuit substrate installed with the parts, and cured to exhibit excellent stress relaxation and heat conductivity; a manufacturing method for the heat conductive silicone gel composition; and a heat conductive silicone gel obtained from the composition. <P>SOLUTION: The manufacturing method for the silicone gel composition comprises: heating a heat conductive filler, an alkenyl group-containing organopolysiloxane, and an organohydrogen polysiloxane together with each other; and then adding an organohydrogen polysiloxane and a curing catalyst. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
