Treatment kit for cleaning substrate surfaces for removal of water and non-water soluble oxides and ionic compounds

摘要

A powder treatment kit for decontaminating metal and metal containing surfaces, removing mill scale, improving the integrity of weldments, removing sulfides, greatly reducing surface oxidation, and mitigating the failure of protective coatings. The powder treatment kit for cleaning substrate surfaces for removal of water and non-water soluble oxides, ionic compounds, oxidized metal species, or other contaminants, comprising a surface pH modifier with a weight percent from 30 percent to 90 percent; a water-soluble oxidizer to react with non-water-soluble sulfides attached to the metal surface, to be dispersed, in an amount from 0.1 wt % to 50 wt %; a pH buffer to maintain a resulting solution pH from 1.5 weight percent to 69.8 weight percent; and a surface tension reducing component.

主权项

1. A treatment kit for cleaning substrate surfaces for removal of water and non-water soluble oxides and ionic compounds comprising:
a. a first powder concentrate formulation for reacting with surface contaminates on a hard surface and dispersing the surface contaminates using a first powder concentrate followed by an additional liquid component for sequentially adjusting the pH of the substrate surface consisting of, based on the weight of the first powder concentrate formulation:
(i) from 40 weight percent to 90 weight percent of an organic acid surface pH modifier for creating an acidic surface on a substrate to disperse oxidized metal species and contaminants, wherein the organic acid surface pH modifier is selected from the group consisting of: citric acid, lactic acid, monosodium phosphate, partial salts of sulfuric acid, and combinations thereof;(ii) from 0.1 weight percent to 50 weight percent of a water-soluble oxidizer to react with and disperse non-water-soluble sulfides, wherein the water-soluble oxidizer is selected from the group: a sodium persulfate, a perborate, a percarbonate, and combinations thereof;(iii) from 1.5 weight percent to 69.8 weight percent of a pH buffer to maintain a resulting solution pH, wherein the pH buffer is selected from the group consisting of: a sodium bisulfate, potassium bisulfate, magnesium bisulfate, ammonium bisulfate, and combinations thereof;(iv) from 0.1 weight percent to 5 weight percent of a surface tension reducing component selected from the group consisting of: a flouroalkyl wetter, a non-ionic silicone polyether and combinations thereof; and(v) optionally, from 3 weight percent to 68.3 weight percent of a rheology modifier to enhance vertical cling; b. an additional liquid treatment component comprising:
a fugitive alkaline pH adjuster; and optionally, a deionized water rinse.