| 发明名称 | Semiconductor device | ||
| 摘要 | The semiconductor device includes: a first die configured to include a first input pad and a first output pad; and a second die configured to include a second input pad and a second output pad. The second die corrects a level of an output voltage in response to a feedback reference voltage applied from the first output pad to the second input pad. | ||
| 申请公布号 | US9197209(B2) | 申请公布日期 | 2015.11.24 |
| 申请号 | US201414307617 | 申请日期 | 2014.06.18 |
| 申请人 | SK Hynix Inc. | 发明人 | Cho Oung Sic;Lee Sang Eun |
| 分类号 | H03K19/003;H03K17/16;H03K19/00;H03K3/012;G05F1/652 | 主分类号 | H03K19/003 |
| 代理机构 | William Park & Associates Ltd. | 代理人 | William Park & Associates Ltd. |
| 主权项 | 1. A semiconductor device comprising: a first die configured to include a first input pad and a first output pad; and a second die configured to include a second input pad and a second output pad, wherein the second die corrects a level of an output voltage in response to a feedback reference voltage applied from the first output pad to the second input pad, wherein the correction of the output voltage is performed until the output voltage level of the first die is matched to the output voltage level of the second die. | ||
| 地址 | Gyeonggi-do KR | ||