发明名称 Method for manufacturing piezoelectric device
摘要 An ion implantation layer is formed in a piezoelectric single crystal substrate by implanting hydrogen ions. A lower electrode is formed on the surface of the piezoelectric single crystal substrate at a side at which the ion implantation layer is formed. A sacrificial layer is formed on the surface of the piezoelectric single crystal substrate at a side at which the ion implantation layer and the lower electrode are formed. The formation of the sacrificial layer is performed by direct formation thereof on the surface of the piezoelectric single crystal substrate, for example, by sputtering or coating. A support layer is formed on the piezoelectric single crystal substrate on which the sacrificial layer is formed, and after the surface of the support layer is planarized, a support base material is bonded thereto.
申请公布号 US9197184(B2) 申请公布日期 2015.11.24
申请号 US201113309626 申请日期 2011.12.02
申请人 Murata Manufacturing Co., Ltd. 发明人 Iwamoto Takashi;Kando Hajime
分类号 H03H3/02;H01L41/04;H03H3/06;H01L41/053;H01L41/08;H01L41/31;H01L41/312;H03H9/05;H03H9/17;H01L21/20;H01L21/304 主分类号 H03H3/02
代理机构 Keating & Bennett, LLP 代理人 Keating & Bennett, LLP
主权项 1. A method for manufacturing a piezoelectric device including a piezoelectric thin film and a support member supporting the piezoelectric thin film, comprising: an ion implantation step of forming an ion implantation layer by implanting ions into a piezoelectric substrate; a sacrificial layer formation step of forming a sacrificial layer on the surface of the piezoelectric substrate at an ion implantation layer side of the sacrificial layer; a support member formation step of forming the support member on the surface of the piezoelectric substrate at the ion implantation layer side; a peeling step of forming the piezoelectric thin film by peeling a portion of the piezoelectric substrate in which the ion implantation layer is formed; and a sacrificial layer removal step of removing the sacrificial layer.
地址 Kyoto JP