发明名称 |
Non-volatile memory devices having dual heater configurations and methods of fabricating the same |
摘要 |
A non-volatile memory device includes a data storage structure coupled between first and second conductive lines of the memory device. The data storage structure includes a conductive lower heater element, a data storage pattern, and a conductive upper heater element sequentially stacked. At least one sidewall surface of the data storage pattern is coplanar with a sidewall surface of the upper heater element thereabove and a sidewall surface of the lower heater element therebelow. Related fabrication methods are also discussed. |
申请公布号 |
US9196827(B2) |
申请公布日期 |
2015.11.24 |
申请号 |
US201213547663 |
申请日期 |
2012.07.12 |
申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
Oh Gyu-Hwan;Park Doo-Hwan;Kim Young-Kuk |
分类号 |
H05B3/00;H01L45/00;H05B3/14;H01L27/02;H01L27/102;H01L27/24 |
主分类号 |
H05B3/00 |
代理机构 |
Myers Bigel Sibley & Sajovec, PA |
代理人 |
Myers Bigel Sibley & Sajovec, PA |
主权项 |
1. A non-volatile memory device comprising:
a data storage structure coupled between first and second conductive lines of the memory device, the data storage structure comprising a conductive lower heater element, a data storage pattern, and a conductive upper heater element sequentially stacked, wherein the data storage pattern includes a sidewall surface that is coplanar with a sidewall surface of the upper heater element and a sidewall surface of the lower heater element, wherein a surface of the lower heater element contacting the data storage pattern includes a protrusion along an edge thereof, and wherein a surface of the data storage pattern contacting the upper heater element includes a protrusion along an edge thereof. |
地址 |
KR |