发明名称 Non-volatile memory devices having dual heater configurations and methods of fabricating the same
摘要 A non-volatile memory device includes a data storage structure coupled between first and second conductive lines of the memory device. The data storage structure includes a conductive lower heater element, a data storage pattern, and a conductive upper heater element sequentially stacked. At least one sidewall surface of the data storage pattern is coplanar with a sidewall surface of the upper heater element thereabove and a sidewall surface of the lower heater element therebelow. Related fabrication methods are also discussed.
申请公布号 US9196827(B2) 申请公布日期 2015.11.24
申请号 US201213547663 申请日期 2012.07.12
申请人 Samsung Electronics Co., Ltd. 发明人 Oh Gyu-Hwan;Park Doo-Hwan;Kim Young-Kuk
分类号 H05B3/00;H01L45/00;H05B3/14;H01L27/02;H01L27/102;H01L27/24 主分类号 H05B3/00
代理机构 Myers Bigel Sibley & Sajovec, PA 代理人 Myers Bigel Sibley & Sajovec, PA
主权项 1. A non-volatile memory device comprising: a data storage structure coupled between first and second conductive lines of the memory device, the data storage structure comprising a conductive lower heater element, a data storage pattern, and a conductive upper heater element sequentially stacked, wherein the data storage pattern includes a sidewall surface that is coplanar with a sidewall surface of the upper heater element and a sidewall surface of the lower heater element, wherein a surface of the lower heater element contacting the data storage pattern includes a protrusion along an edge thereof, and wherein a surface of the data storage pattern contacting the upper heater element includes a protrusion along an edge thereof.
地址 KR