发明名称 発光ダイオードパッケージを有するバックライトアセンブリ
摘要 A backlight assembly includes a first light emitting unit having a first light emitting diode, a second light emitting unit having a second light emitting diode, a third heat conduction member, and a receiving container accommodating the first light emitting unit and the second light emitting unit. The first light emitting unit includes a first heat conduction member connected to the first light emitting diode to absorb a heat from the first light emitting diode, and the second light emitting unit includes a second heat conduction member connected to the second light emitting diode to absorb a heat from the second light emitting diode. A third heat conduction member is connected to the first and second heat conduction members to discharge the heats from the first and second light emitting diodes.
申请公布号 JP5820217(B2) 申请公布日期 2015.11.24
申请号 JP20110214858 申请日期 2011.09.29
申请人 三星ディスプレイ株式會社Samsung Display Co.,Ltd. 发明人 尹 冑 永;宋 煕 光
分类号 F21S2/00;F21V29/503;H01L33/00 主分类号 F21S2/00
代理机构 代理人
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