| 摘要 |
PROBLEM TO BE SOLVED: To provide a component built-in substrate which allows for ultra-high speed signal transmission with stabilized power supply, by minimizing the impedance of a power supply circuit.SOLUTION: A component built-in substrate includes a LSI chip 5, a build-up layer 4 on which a power supply circuit 8 for connection with the power supply terminal of the LSI chip is formed, a core layer 3 on which the build-up layer 4 is laminated, and a plurality of chip capacitors 7 built in the core layer 3 as a component, and connected with the power supply circuit of the build-up layer 4 to form a capacitor for the power supply circuit. At least 100 chip capacitors are arranged per an area of 1 square cm. |
