Molded leadframe substrate semiconductor package

摘要

A process for forming land grid array semiconductor packages includes a leadframe that is supported by a substrate comprising mold compound. In some embodiments, at least one die is electrically coupled to the leadframe by bondwires. The package comprises a second mold compound to act as an encapsulant. An apparatus for forming a land grid array semiconductor package includes means for molding a leadframe, assembling thereon at least one semiconductor device, applying a second mold, and singulating to form individual devices. A land grid array package comprises a leadframe, a substrate for supporting the leadframe, at least one semiconductor device and a mold compound.

主权项

1. A process of forming semiconductor packages, the process comprising:
a. at least partially encasing a first leadframe strip in a first mold compound thereby forming a molded leadframe strip, wherein the molded leadframe strip includes a first planar surface and a second planar surface that is lower than the first planar surface, wherein at least partially encasing a first leadframe strip in a first mold compound comprises:
i. placing the first leadframe strip in a mold cavity, wherein the mold cavity includes an emboss feature and is defined by a top mold and a bottom mold, wherein the bottom mold includes a tape loader providing a tape that includes pre-formed holes configured to receive protrusions on a mold surface; andii. injecting the first mold compound into the mold cavity; b. directly mounting at least one semiconductor device on the first mold compound between a first portion of the second planar surface and a second portion of the second planar surface; c. mounting bondwires on the at least one semiconductor device to effectuate electrical contact between the at least one semiconductor device and the second planar surface; d. mounting at least one cap on the molded leadframe strip, wherein each of the at least one cap includes a lateral surface that is perpendicular and is affixed to the first planar surface; e. at least partially encasing the molded leadframe strip and at least a top portion of the at least one cap in a second mold compound; and f. singulating the molded leadframe strip to form discrete semiconductor packages.