发明名称 Foamed resin molded product, foamed insulated wire, cable and method of manufacturing foamed resin molded product
摘要 A foamed resin molded product includes not less than two fluorine resins that have a different melting point from each other. One of the not less than two fluorine resins comprises a fluorine resin that has a melting point of not more than 230 degrees C. An other of the not less than two fluorine resins comprises a fluorine resin that has a melting point of not less than 40 degrees C. higher than the fluorine resin having the melting point of not more than 230 degrees C.
申请公布号 US9196393(B2) 申请公布日期 2015.11.24
申请号 US201313844895 申请日期 2013.03.16
申请人 HITACHI METALS, LTD. 发明人 Abe Masahiro;Nagano Masafumi;Nakayama Akinari
分类号 H01B7/02;H01B3/44 主分类号 H01B7/02
代理机构 McGinn IP Law Group, PLLC 代理人 McGinn IP Law Group, PLLC
主权项 1. A foamed resin molded product, comprising: not less than two fluorine resins that have a different melting point from each other, wherein one of the not less than two fluorine resins comprises a fluorine resin that has a melting point of not more than 230 degrees C., wherein an other of the not less than two fluorine resins comprises a fluorine resin that has a melting point of not less than 40 degrees C. higher than the fluorine resin having the melting point of not more than 230 degrees C., and wherein the foamed resin molded product is obtained by mixing and foaming a master batch comprising the fluorine resin that has the melting point of not more than 230 degrees C. and a chemical foaming agent, and a base resin comprising at least the fluorine resin that has the melting point of being not less than 40 degrees C. higher than the fluorine resin having the melting point of not more than 230 degrees C. by an extrusion molding method, wherein the fluorine resin having the melting point of not more than 230 degrees C. comprises an ethylene-tetrafluoroethylene-hexafluoropropylene copolymer (EFEP), and wherein the fluorine resin having the melting point of not less than 40 degrees C. higher than the fluorine resin having the melting point of not more than 230 degrees C. comprises a tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA) or a tetrafluoroethylene-hexafluoropropylene copolymer (FEP).
地址 Tokyo JP